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MEGUM™
MEGUM™ rubber-to-substrate bonding
MEGUM™ rubber-to-substrate adhesives are used to bond a variety of elastomer compounds to metal and plastic substrates including steel, stainless steel, aluminum, zinc, copper, polyamides, polyacetals, polyesters, and PTFE.
Most formulations are low-viscosity, organic, solvent-based solutions and/or dispersion of polymers and other reactive chemicals. Water-based and MIBK-free formulations are also available.
Advantages
For curing systems
Suitable for all common curing systems, especially fast-curing natural rubbers and rubber blends
High resistance
To heat, salt, fog, oil, water immersion, corrosion, and hydrolysis
Enables NVH management
For better acoustics
Formulation advantages
Free of reportable levels of lead (or other heavy metals), chlorinated solvents, or ozone-depleting chemicals
Markets
Automotive
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Case studies and related content
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Get longer service life by bonding polyimide to electronic wires and cable cores.
Resources
Water-based adhesive from DuPont enables first-to-market success for bonded rollers
Sustainable solutions for NVH challenges
MEGUM™/THIXON™ rubber-to-substrate bonding agents. Product selector guide
MEGUM™/THIXON™ rubber-to-substrate bonding agents. Product selector guide—North America
Rubber-to-metal bonding agents technical guide. Bonding performance
Rubber-to-substrate bonding technical guide. Substrate preparation
Rubber-to-substrate bonding agents technical guide. General use of specialty adhesives