Back-end

DuPont solutions for precision testing and packaging without damaging delicate wafers

DuPont™ Vespel® parts for back-end processes won’t damage wafers like metal or ceramic. In fact, Vespel® prevents scratches and allows for greater precision.

Wafer handling, packaging, and testing are critical in delivering high-quality chips. At each step, there’s a risk of damage. Vespel® is ideal for semiconductor packaging, testing, and pick-up collets because it provides:

• Dimensional stability
• Low wear
• Low CTE (coefficient of thermal expansion)
• Low moisture absorption

Plus, Vespel’s® balanced mechanical properties allow for dimensional stability and precision machinability as a housing material of test sockets.

Vespel®

Wear-resistant solutions for safe handling and testing of semiconductor chips

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Ideas & innovations

Powered by a broad product portfolio and state-of-the-art expertise, we help our partners meet the critical industry demands of the electrical and electronics market.

Vespel® SF Foam Products Offer Performance At Extreme Temparatures